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Fabrication of diamond/Cu direct bonding interface for power device applications
http://hdl.handle.net/10097/00129728
http://hdl.handle.net/10097/0012972891d5fad5-1430-419f-b8dd-0393f31e4785
名前 / ファイル | ライセンス | アクション |
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OHNO-Yutaka-2020Tour01-211.pdf (1.1 MB)
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© 2019 The Japan Society of Applied Physics
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Item type | 学術雑誌論文 / Journal Article(1) | |||||
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公開日 | 2020-12-02 | |||||
タイトル | ||||||
タイトル | Fabrication of diamond/Cu direct bonding interface for power device applications | |||||
言語 | ||||||
言語 | eng | |||||
資源タイプ | ||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
資源タイプ | journal article | |||||
著者 |
Shinji, Kanda
× Shinji, Kanda× Yasuo, Shimizu× Yutaka, Ohno× Kenji, Shirasaki× Yasuyoshi, Nagai× Makoto, Kasu× Naoteru, Shigekawa× Jianbo, Liang |
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書誌情報 |
Japanese Journal of Applied Physics 巻 59, 号 SB, p. SBBB03-1-SBBB03-5, 発行日 2019-11-26 |
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ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 0021-4922 | |||||
DOI | ||||||
関連タイプ | isVersionOf | |||||
識別子タイプ | DOI | |||||
関連識別子 | 10.7567/1347-4065/ab4f19 | |||||
情報源 | ||||||
識別子タイプ | URI | |||||
関連識別子 | https://iopscience.iop.org/article/10.7567/1347-4065/ab4f19 | |||||
関連名称 | 出版社サイト | |||||
著者版フラグ | ||||||
出版タイプ | AM | |||||
出版タイプResource | http://purl.org/coar/version/c_ab4af688f83e57aa | |||||
出版者 | ||||||
出版者 | IOP publishing | |||||
資源タイプ | ||||||
内容記述タイプ | Other | |||||
内容記述 | 学術論文(Ariticle) | |||||
登録日 | ||||||
日付 | 2020-12-02 | |||||
日付タイプ | Created | |||||
公開日(投稿完了日) | ||||||
日付 | 2020-12-02 | |||||
日付タイプ | Created | |||||
発行日 | ||||||
日付 | 2019-11-26 | |||||
日付タイプ | Created | |||||
公開範囲 | ||||||
値 | 学外 | |||||
登録者コメント | ||||||
利用は私的利用(著作権法第30条)および引用(著作権法第32条)の範囲内に限られる。 |