@article{oai:tohoku.repo.nii.ac.jp:00132338,
 author = {Shinji, Kanda and Yasuo, Shimizu and Yutaka, Ohno and Kenji, Shirasaki and Yasuyoshi, Nagai and Makoto, Kasu and Naoteru, Shigekawa and Jianbo, Liang},
 issue = {SB},
 journal = {Japanese Journal of Applied Physics},
 month = {Nov},
 note = {学術論文(Ariticle)},
 pages = {SBBB03-1--SBBB03-5},
 title = {Fabrication of diamond/Cu direct bonding interface for power device applications},
 volume = {59},
 year = {2019}
}